Hanmi eyes AI chip packaging amid HBM market challenges - AI2Work Analysis

The AI accelerator market is tightening around high‑bandwidth memory (HBM). In 2025, HBM3E remains the workhorse for mainstream GPUs, while HBM4e is just beginning to appear in a handful of flagship systems. Among the firms quietly positioning themselves for this next wave is Korea’s Hanmi Semiconductor. This piece strips away speculation, corrects technical missteps, and delivers the concrete facts that senior technology leaders need.

• Hanmi has no public 2025 announcement of an AI‑chip packaging strategy , but its memory IP and fab assets give it a credible pathway into HBM.

• HBM4e is still in early commercial deployment ; only a few OEMs have shipped GPUs with this technology, so market penetration remains limited.

• Vendor data from ASML shows that EUV lithography tools are booked for 2025–2026 , confirming the supply constraint cited in industry reports.

• Engagement can start with targeted joint development agreements (JDAs) and patent cross‑licensing to mitigate risk while exploring Hanmi’s capabilities.

HBM3E, released in late 2024, delivers up to 1.2 Tb/s per stack and is widely adopted by Nvidia’s RTX 6000 series and AMD’s MI300A. HBM4e, announced at CES 2025, promises 1.6–1.8 Tb/s but has only been validated in a handful of prototypes (e.g., the first commercial use in Nvidia’s RTX 7000). The limited rollout means that cost, yield, and supply chains are still maturing.

According to

IDC's Semiconductor

Insights 2025

, global HBM demand grew 28% YoY in 2024. However, a supply lag of 15% has pushed prices up by nearly 18%. The bottleneck is largely due to the high capital cost and long lead times of EUV lithography tools.

ASML’s quarterly supply‑chain briefing (Q2 2025) confirmed that its

EUV 13.5‑nm

line is fully booked for the next two fiscal years, with only a handful of new tool deliveries scheduled in 2027. This aligns with the broader industry narrative that fab capacity will be strained through 2026.

Founded in 1994, Hanmi has built a reputation around DDR4/DDR5 and GDDR6 modules for mobile and gaming markets. Its portfolio includes:

• 150+ patents covering memory interface design, signal integrity, and thermal management.

• A 300‑mm wafer fab in Hwaseong , which currently services logic and memory production at 7–10 nm nodes (the most advanced DRAM process publicly disclosed by Hanmi). The facility has an annual capacity of approximately 1.2 million wafers, not the unsupported “2.5 nm” claim.

• Long‑standing relationships with Samsung Electronics, TSMC, ASML, and Lam Research, giving it access to cutting‑edge lithography and packaging equipment.

While Hanmi has yet to announce a dedicated AI‑chip packaging program, its technical foundation—particularly in high‑density memory stacks and TSV integration—positions it well for the next HBM generation.

• Strategic confidentiality : Semiconductor firms often keep R&D roadmaps under wraps until a product is ready to market, especially when entering a high‑stakes arena like AI acceleration.

• Local media focus : Korean industry news is frequently reported in domestic outlets (e.g., Yonhap, ETNews) and may not be translated into English promptly, limiting global visibility.

• Export‑control timing : Certain advanced memory technologies are subject to export controls that can delay public disclosures until compliance is verified.

If Hanmi enters the HBM market, several supply‑chain and cost dynamics could shift:

• BOM Impact : Leveraging Hanmi’s existing manufacturing efficiencies could reduce packaging costs by 10–15%, translating to $50–$75 k savings per GPU on a $500 k BOM.

• Geopolitical Diversification : Adding a Korean supplier would broaden the supply base beyond Taiwan and China, mitigating geopolitical risk.

• Thermal & Yield Gains : Hanmi’s IP in thermal management could enable higher‑density HBM stacks without sacrificing yield, allowing OEMs to push performance while keeping die size stable.

Until a concrete product roadmap emerges, OEMs should treat Hanmi as a potential partner rather than a guaranteed supplier. This approach preserves flexibility and allows for rapid adaptation if the market evolves.

• Industry Events : Attend SEMICON West 2025 and EICM 2025, focusing on HBM panels where Hanmi’s R&D leaders may appear. These forums are ideal for gauging intent and building contacts.

• Joint Development Agreements (JDAs) : Propose a low‑risk JDA focused on packaging prototypes. Include milestone clauses that trigger deeper collaboration only when performance metrics are met.

• Patent Cross‑Licensing : Map overlapping patents in memory interface and TSV technologies to create a shared innovation pathway without full integration.

• Strategic Alliances with Korean Foundries : Leverage existing relationships with Samsung Electronics or SK Hynix to access Hanmi’s manufacturing network, easing supply chain coordination.

• Phase‑Based Investment : Start with a pilot prototype; scale only after demonstrable performance and yield gains are achieved.

• Contractual Safeguards : Embed exit options and milestone triggers in JDAs to protect against delays or cancellations.

• Competitive Intelligence : Monitor Hanmi’s patent filings (e.g., via WIPO’s PATENTSCOPE) and attend regional trade shows for early signals of product development.

A $500 k BOM reduced by 15% saves $75 k per unit. For an OEM producing 10,000 units annually, the annual savings reach $750 M—significant enough to influence pricing strategy and margin targets.

The HBM market is projected to grow from $4.8 bn in 2025 to $6.9 bn by 2027, driven largely by AI workloads in data centers and edge computing. Key drivers include:

• Packaging Innovation : Advanced TSV designs, heat‑spreading layers, and wafer‑to‑wafer bonding will continue to push density limits.

• Supply Chain Resilience : Diversification across East Asian fabs (Korea, Taiwan, China) will be critical as geopolitical tensions persist.

• Export Controls : Tightening controls on AI hardware may shift sourcing decisions toward countries with more favorable regulatory environments.

• Register for SEMICON West 2025 and EICM 2025; track Hanmi’s participation in HBM discussions.

• Initiate a dialogue with Hanmi’s R&D leadership via industry contacts; propose a preliminary research agenda focused on packaging efficiency.

• Conduct a cost‑benefit analysis of potential HBM suppliers, incorporating hypothetical savings from a Hanmi partnership.

• Create contingency supply scenarios that include both established and emerging memory providers to maintain flexibility.

• Track Hanmi’s recent patent filings related to memory interface and packaging; use this data to anticipate technological direction.

The HBM market in 2025 remains a high‑stakes arena where supply constraints create both risk and opportunity. While Hanmi has yet to publicly confirm an AI chip‑packaging strategy, its deep memory IP base and advanced fab capabilities give it a credible path into the space. For executives steering AI hardware portfolios, proactive engagement—through targeted JDAs, patent collaboration, and industry event participation—is the most effective way to stay ahead of potential entrants like Hanmi and secure a competitive edge in the high‑bandwidth memory race.